Indira Ponte Ribeiro, Francisco Frederico dos Santos Matos, Auzuir Ripardo Alexandria
Este trabalho apresenta a análise da influência da temperatura na
eficiência de um painel solar, sob condições de irradiação constante. As
geometrias usadas na simulação foram criadas no software ICEM, usando
dimensões reais de um painel solar, que foram então processadas no
software ANSYS CFX. O objetivo deste trabalho é avaliar o percentual de
perda de potência causado pelo aumento da temperatura. Simulou-se a
temperatura na interface do painel em dois casos distintos: com e sem a
presença de circulação de ar. Os resultados mostram uma redução gradual
do percentual de perda de potência, em função da diminuição da
temperatura do painel, conforme se resfria a interface entre os
domínios. Ao se comparar o percentual de perda de potência das
simulações que apresentaram a maior e a menor temperatura no painel,
obteve-se uma redução de 75 % da queda de potência.
This work presents the influence of temperature on the efficiency of a solar panel under conditions of constant irradiation. The geometries used in simulation were created in the software ICEM, using the real dimensions of a photovoltaic panel, which were in turn processed in the software ANSYS CFX. The objective of this study is to evaluate the power loss percentage caused by the increase in temperature. The temperature was simulated in the panel interface for two different cases: with and without the presence of air circulation. The results show a gradual reduction of power loss percentage, due to the decrease the temperature of the panel, as the boundary interface cools down. When comparing the power loss percentage of the simulations that showed the highest and the lowest temperature in the panel, it was obtained a 75% reduction of power loss.
This work presents the influence of temperature on the efficiency of a solar panel under conditions of constant irradiation. The geometries used in simulation were created in the software ICEM, using the real dimensions of a photovoltaic panel, which were in turn processed in the software ANSYS CFX. The objective of this study is to evaluate the power loss percentage caused by the increase in temperature. The temperature was simulated in the panel interface for two different cases: with and without the presence of air circulation. The results show a gradual reduction of power loss percentage, due to the decrease the temperature of the panel, as the boundary interface cools down. When comparing the power loss percentage of the simulations that showed the highest and the lowest temperature in the panel, it was obtained a 75% reduction of power loss.
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